“direct wafer bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	direct wafer bonding technology
释义	direct wafer bonding technology Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	bioactive glass bioactive materials bioactive modification bioactive nature product bioactive peptide bioactive peptides bioactive polymer bioactive small molecules bioactivity bioactivity assay bioactivity assay for monoclonal antibody bioactivity assay for recombinant exendin-4/HSA fusion protein bioactivity assay for recombinant human erythropoietin bioactivity assay for recombinant human GLP-1 analog-Fc fusion protein bioactivity assay for remodeled recombinant human acid α-glucosidase bioactivity assay for remodeled recombinant human placental-derived β-glucocerebrosidase bioactivity determination of crude drug bio-additive manufacturing bio-adhesives bioaerosol bioaffinity bioaffinity sensor bioalkylating agents bioallethrin bioarchaeology

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