“direct wafer bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	direct wafer bonding technology
释义	direct wafer bonding technology Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	models of policy evaluation models of social work model solar atmosphere models or patterns of opera teaching model space model specification model specification for military aero-engine model stellar atmosphere model structure model system model test for spacecraft model test of aircraft ditching model test of fishing net gear model test of fishing net gear in tank model test of fishing net gear in wind tunnel model test of hydraulic structure model test of hydroturbine model-theoretic algebra model-theoretical」模型论的 model-theoretic forcing method Model-Theoretic Semantics model-theoretic 「= model theory model training method model transformation

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