“direct wafer bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	direct wafer bonding technology
释义	direct wafer bonding technology Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	exhibition held in convention centers exhibition held in cultural centers exhibition held in libraries exhibition held in science and technology museum exhibition held in urban planning exhibition centers exhibition held in zoos exhibition housed in exhibition space exhibition information anxiety exhibition installation exhibitionistic disorder Exhibition Jointly Orgainzed by the Palace Museum in Peking and the Central Museum in Nanking exhibition liability insurance exhibition material exhibition micro-environment design Exhibition of Artistic Design Works, National Exhibition of Fine Arts Exhibition of Chinese Contemporary Experimental Works of Ceramic Arts Exhibition of Modern Photo Salon in 1986 exhibition outline exhibition plan exhibition procedure exhibition production room exhibition programs design exhibition project evaluation exhibition project management exhibition proposal evaluation

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