“direct wafer bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	direct wafer bonding technology
释义	direct wafer bonding technology Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	computational process computational reducibility computational scheme computational science computational sciences computational security Computational Seismology Computational Semantics computational semantics computational short cut computational singular perturbation theory computational social science computational soft matter computational software of multiphase flow computational solid mechanics computational spectrophotometry computational statistics computational stochastic mechanics computational structural mechanics Computational Stylistics Computational Syntax computational system Computational Terminology computational topology computational wind engineering

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。