“direct wafer bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	direct wafer bonding technology
释义	direct wafer bonding technology Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	Compilation of Memorials to the Throne with the Emperor's Comments in Cinnarba-ink of the Guangxu Era Compilation of Memorials to the Throne with the Emperor's Comments in Cinnarba-ink of the Yongzheng Era Compilation of Notes on Classical Poetry Compilation of Notices on the Translation of the Tripitaka Compilation of Oracle Bone Inscriptions Compilation of Seal Inscriptions Compilation of Selected Poems and Poetic Theories Compilation of Shaanxi Traditional Repertoire· Shaanxi Opera Compilation of Tang Dynasty Epitaphs Compilation of Taoist Witchcrafts Compilation of Telegrams from the Collection of the Imperial Military Council of the Qing Dynasty Compilation of Textual Researches on Calligraphy Compilation of the literature on the ethno-national Question Compilation of The Lose Compilation of Theories on Formal Style Script Compilation of Works of Sheng Hui compilation procedure of archival documents Compilations of Judicial verdicts from Central Judicial Office compilation system compile compile and expound compile by alphabet compile by chronicle compile byclassfication compile by regional

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。