“direct wafer bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	direct wafer bonding technology
释义	direct wafer bonding technology Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	three-wave process three way catalyst three-way catalyst three-way catalytic converter three-way Doppler three way handshake three-way light time three-web three wings lead survey three wisdoms Three Women Three Worlds Three Year Action Plan for Pre-School Education Three-year Action Plan of Provincial Environmental Protection and Construction three year plan for British films three years of continuous drought from 1959 to 1961 in China Three Zaju Dramas by Kushui Three Zaju Poetic Dramas on the Taiping Rebellion Three Zhus of Jiading school Threlfall threo configuration threo diisotactic polymer threo-diisotactic polymer threo disyndiotactic polymer threo-disyndiotactic polymer

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