“direct wafer bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	direct wafer bonding technology
释义	direct wafer bonding technology Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	high order relaxation, high-order relaxation high-order residual aberration high order scheme high order structure analysis of monoclonal antibody high order transverse mode generation technology high overload capability distribution transformer high pass filter high-pass filter high pass filter, high-pass filter highpass filtering high-pass filter or CR Differential circuit high-pass filters highpass filters high-peak bias high peak power laser high people's court High performance anticorrosive coating high performance building envelope high performance capillary electrophoresis high performance computer high performance computing high performance computing cluster high performance computing cluster, HPC cluster high performance concrete high-performance concrete structure

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