“直接晶圆键合技术”的概念、定义、翻译、参考文献-科学参考

单词	直接晶圆键合技术
释义	直接晶圆键合技术 Encyclopedia 工学封装技术释 direct wafer bonding technology直接晶圆键合技术晶圆表面无须外加黏结剂、焊料或其他辅助材料，通过晶圆表面间的化学反应、扩散或分子间作用力等来实现晶圆结合的技术。是键合技术的一种。
随便看	Administrative Measures for the Security Protection of Computer Network International Network Administrative Measures for the Site Selection Planning of Construction Projects administrative measures for traffic safety management Administrative Measures of Key Scientific Research Bases of National Cultural Heritage Administration Administrative Measures of Restoration of Movable Cultural Relics administrative mediation Administrative methods administrative middleware technology administrative monopoly administrative objective administrative omission administrative order administrative organization administrative organization law Administrative Organizations of China Electric Power administrative penalties for traffic safety violations administrative penalty administrative penalty for work safety and health administrative planning administrative power list system administrative principles of urban and rural planning administrative procedure Administrative Procedure Act,APA administrative procedure law Administrative Procedure Law of the People's Republic of China

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。