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电子封装可靠性
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电子封装可靠性
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工学
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reliability of electronic packaging
电子封装可靠性
在工作环境下电子封装的结构缺陷(气孔,裂纹,翘曲,分层等)状态对其微电子电路正常有效工作能力影响的评价。
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degree of excitation
degree of exploration
degree of field extension
degree of final dependence
degree of financial leverage
degree of finite morphism
degree of fluctuation
degree of forbiddenness
degree of freedom
degree-of-freedom criteria
degree of freedom of multielement and multi phase system
degree of freedom of multielement and multi-phase system
degree of hollowness
degree of homogeneity
degree of hydrolysis
degree of impairment
degree of injury
degree of inseparability
degree of insolvability
degree of interlacing
degree of ionization
degree of isotacticity
degree of kinship
degree of mapping
degree of nilpotency
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