“晶圆级封装发光二极管切割”的概念、定义、翻译、参考文献-科学参考

单词	晶圆级封装发光二极管切割
释义	晶圆级封装发光二极管切割 Encyclopedia 工学发光二极管封装工艺释 wafer level packaging light emitting diode cutting晶圆级封装发光二极管切割对发光二极管整个晶圆进行封装测试，再进行切割而得到单个成品芯片的工艺过程。
随便看	image terrain correction image texture feature extraction image theatre image theory image thinking image tie point image trailer image transform image transformation image transmitting fiber image tube image tube spectrograph image under a mapping image understanding image understandingof remote sensing image understanding system image velocimetry image watermarking image X-ray photoelectron spectroscopy image Xray photoelectron spectroscopy imaginal bud imaginal disc imaginal organogenesis imaginal thinking method imaginary

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。