理学 计算机硬件电路 释 multi-chip package; MCP 多芯片封装 内部包含了多个集成电路的封装形式。
计算机硬件 计算机集成电路 释文 multi-chip package, MCP 多芯片封装
- Tirupati
- TISA
- TISAB
- Ti-sapphire laser
- Ti:sapphire laser
- Tisch School of the Arts
- Tisch School of the Arts, New York University
- Tiselius crater
- tisraḥ śikṣāh
- Tisserand's criterion
- Tisserand's relation
- Tissot
- Tissot differential equation
- Tissot indicatrix
- Tissot-Pochhammer differential equation
- tissue
- tissue and cell culture
- tissue and organ printing
- tissue-based biosensor
- tissue-based sensor
- tissue bridge
- tissue chip
- tissue condensation
- tissue construction for vascularization
- tissue culture