理学 计算机硬件电路 释 multi-chip package; MCP 多芯片封装 内部包含了多个集成电路的封装形式。
计算机硬件 计算机集成电路 释文 multi-chip package, MCP 多芯片封装
- ground positioning orientation and aiming system
- ground power supply and distribution test equipment
- ground pressure
- ground pressure around openings
- ground pressure around shaft
- ground pressure in stopes
- ground pressure management
- ground propagation
- ground proximity warning system
- ground radiation
- ground receiving station
- ground receiving station for meteorological satellite
- ground release test of airborne
- ground remote sensing
- ground resolution
- ground resolution principle
- ground resonance test
- ground ring
- ground road
- ground robot
- ground roll
- ground rolling dragon
- ground rope
- ground row
- ground-satellite communication