“圆片键合”的概念、定义、翻译、参考文献-科学参考

单词	圆片键合
释义	圆片键合 Encyclopedia 工学磁致动器释 wafer bonding圆片键合将两个具有不同晶向和晶格常量的完整的大尺寸平坦镜面的圆片所需要形成接触的区域一次性地通过物理化学方法连接起来，形成特殊功能或新材料性能，并保证接触区域具有足够的机械强度和合适的电子特性的一种半导体制造技术。
随便看	inorganic layered compound inorganic mass spectrometry for pharmaceutical analysis inorganic membrane inorganic molecular probe inorganic nanomaterials inorganic nanoparticle-based vector inorganic new energy materials inorganic non-metallic materials inorganic nonmetallic materials technology inorganic nonmetallic reinforcements inorganic nutrition inorganic organic hybrid composites inorganic origin theory of petroleum inorganic phase change materials inorganic pigment inorganic pollutant inorganic pollution of water body inorganic polymer inorganic polymer matrix composites inorganic polyporate material inorganic preparation inorganic salt inorganic salt industry inorganic scintillator inorganic supermolecule materials

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。