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圆片键合
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圆片键合
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wafer bonding
圆片键合
将两个具有不同晶向和晶格常量的完整的大尺寸平坦镜面的圆片所需要形成接触的区域一次性地通过物理化学方法连接起来,形成特殊功能或新材料性能,并保证接触区域具有足够的机械强度和合适的电子特性的一种半导体制造技术。
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ceramic matrix composite
ceramic matrix composites
ceramic-mesh sand screen
ceramic-metal seal
ceramic mold casting
ceramic nuclear fuel
ceramicon
ceramic package
ceramic painted decoration
ceramic particle
ceramic pipes or vitrified clay pipes
Ceramic Plastic Art
ceramic plate with dragon decoration from Taosi
ceramic powder
ceramic precursor
ceramic printing
ceramic raw material technology
Ceramic Research Institute of light Industry of China
ceramics
ceramic sanitary ware
ceramics collections in National Art Museum of China
ceramic sculptures
ceramic sensor
ceramic sintering
ceramics made by using tailings as major raw materials
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