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圆片键合
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圆片键合
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wafer bonding
圆片键合
将两个具有不同晶向和晶格常量的完整的大尺寸平坦镜面的圆片所需要形成接触的区域一次性地通过物理化学方法连接起来,形成特殊功能或新材料性能,并保证接触区域具有足够的机械强度和合适的电子特性的一种半导体制造技术。
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Treat of Central Asia between Britain and Russia in 1873
Treat of Darin
Treat of Jeddah
treat the elderly kindly
treaty
Treaty between the Government of the Republic of India and the Government of the People's Republic of Bangladesh on Sharing of the Ganga/Ganges Waters at Farakka
Treaty for the Elimination of Medium-range Missile
Treaty for the Establishment of the East African Community
Treaty for the Prohibition of Nuclear Weapons in Latin America
Treaty for the Settlement of Outstanding Questions Pertaining to Shandong
treaty interpretation in the course of WTO dispute settlement
Treaty of 1901
Treaty of Adrianople
Treaty of Aigun
Treaty of Alcaçovas
Treaty of Alliance
treaty of alliance
Treaty of Alliance Between United Kingdom and Iraq
Treaty of Amiens
Treaty of Amity and Commerce between Zanzibar and U.S.A.
Treaty of Ancón
Treaty of Bardo
Treaty of Beijing
Treaty of Berlin
Treaty of Britain 、Soviet Union and Iran Alliance
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