“同轴封装技术”的概念、定义、翻译、参考文献-科学参考

单词	同轴封装技术
释义	同轴封装技术 Encyclopedia 工学光电子器件耦合封装技术释 coaxial packaging technology同轴封装技术借用晶体管器件常用的封装形式，在外观结构上围绕光轴呈轴对称分布的技术。又称TO封装，即transistor outline或者through-hole封装技术。
随便看	3D circular loom 3D CNC plate bending machine for ship doubly curved hull 3D composite flexible weaving 3D cooperative design of hydraulic structures 3D CT reconstruction 3D digital camera 3D digitizer 3D display device 3D display technology 3D electron microscopy 3D-EM 3d exploration seismometer 3D geographic information system 3D geological & geophysical modeling 3D geological structure model 3D geologic modeling 3D GIS 3D glasses 3D graphics application programming interface 3D holographic display technology 3 D imaging 3-D imaging 3D imaging 3-dimensional classification 3-dimensional conformal radiation therapy，3DCRT

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。