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厚膜介质浆料
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厚膜介质浆料
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电子元器件浆料
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thick film dielectric pastes
厚膜介质浆料
具有一定绝缘电阻和介电常数,烧结后浆料的膜层厚度通常控制在20~100微米的膏状印刷用电子元器件浆料。
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