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厚膜介质浆料
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厚膜介质浆料
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工学
电子元器件浆料
释
thick film dielectric pastes
厚膜介质浆料
具有一定绝缘电阻和介电常数,烧结后浆料的膜层厚度通常控制在20~100微米的膏状印刷用电子元器件浆料。
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thermal acclimation
thermal accommodation coefficient
thermal acoustic oscillation
thermalaction
thermal activation
thermal activation flux creep
thermal activation vortex creep
thermal actuators
thermal after-effect
thermal ag[e]ing
thermal ageing
thermal aging
thermal agitation
thermal analysis
thermal analysis coupled with gas chromatograph-mass spectrometry
thermal analysis coupled with infrared spectroscopy
thermal analysis coupled with mass spectrometry
thermal analysis for pharmaceutics
thermal analysis instrument
thermal analysis kinetics
thermal analysis (TA)
thermal analyzer
thermal anchoring
thermal and mechanical properties of semiconductor
thermal and moisture balance of swine building
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