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厚膜介质浆料
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厚膜介质浆料
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工学
电子元器件浆料
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thick film dielectric pastes
厚膜介质浆料
具有一定绝缘电阻和介电常数,烧结后浆料的膜层厚度通常控制在20~100微米的膏状印刷用电子元器件浆料。
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Forced Migration
forced mixer
forced mode-locking
forced motion
forced movement
forced nutation
forced oscillation
forced outage rate
forced polygon
forced regression
forced regressive coal accumulation
forced response
forced swim test
forced synchronization
forced transition
force due to viscosity
forced Van der Pol oscillator
forced vibration
forced vital capacity
force dynamics
force equilibrium
force equilibrium state
force-fed duck
force field
force field model
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