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厚膜介质浆料
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厚膜介质浆料
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工学
电子元器件浆料
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thick film dielectric pastes
厚膜介质浆料
具有一定绝缘电阻和介电常数,烧结后浆料的膜层厚度通常控制在20~100微米的膏状印刷用电子元器件浆料。
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complex programming logic device
complex programming logic device, CPLD
complex progression
complex projective plane
complex projective space
complex quadratic form
complex quantity
complex random process
complex random variable
complex ray
complex ray method
complex reaction
complex refractive index
complex regulatory systems
complex relative attenuation
complex representation
complex residue
complex resistivity logging
complex resolution
complex resonator
complex root
complex rotation
complex rotation group
complex salt effect
complex sample analysis
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