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厚膜介质浆料
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厚膜介质浆料
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工学
电子元器件浆料
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thick film dielectric pastes
厚膜介质浆料
具有一定绝缘电阻和介电常数,烧结后浆料的膜层厚度通常控制在20~100微米的膏状印刷用电子元器件浆料。
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deformation flow
deformation-free continuum
deformation induced ferrite transformation
deformation inversion
deformation lamellae
deformation measurement
deformation mechanism
deformation observation network
deformation of amorphous materials
deformation of an algebraic variety
deformation of an analytic structure
deformation of a surface
deformation of fiber
deformation of liquid crystal
deformation of roadbed
deformation of rock
deformation of the air preheater
deformation parameter
deformation partitioning
deformation point
deformation potential
deformation process
deformation quantization
deformation ratio
deformation reinforcement theory
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