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厚膜介质浆料
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厚膜介质浆料
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工学
电子元器件浆料
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thick film dielectric pastes
厚膜介质浆料
具有一定绝缘电阻和介电常数,烧结后浆料的膜层厚度通常控制在20~100微米的膏状印刷用电子元器件浆料。
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interface material
interface morphology of solidification
interface of ceramics
interface of satellite and rocket
interface problem
interface reaction
Interface Region Imaging Spectrograph
interface requirements
interface resistance
interface scattering
interfaces of crystalline materials
interface specification
interface state
interfaces within pratacultural system
interface technology in steel manufacturing process
interface tensiometer
interface testing
interface tracking method
interfacial
interfacial adsorption
interfacial area concentration
interfacial charge transfer
interfacial crud
interfacial electrochemistry
interfacial electronic structure
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