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单晶片吸除技术
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单晶片吸除技术
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gettering of semiconductor wafers
单晶片吸除技术
在远离硅片表面层的体内或背表面层人为地形成缺陷或损伤,吸除正表面层内的微缺陷和快扩散的重金属杂质,使表面层内既无缺陷又无有害金属杂质沾污的技术。又称吸杂技术。
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