工学 胶接 释 bonding 胶接 利用胶黏剂在连接面上产生的机械结合力、物理吸附力和化学键合力而使两个或两个以上胶接件连接起来的工艺方法。 工学 微纳机电系统 释 bonding 键合 通过化学和物理作用将硅片与硅片、硅片与玻璃片、金属与玻璃、金属与金属、塑性材料之间或其他材料之间紧密地结合起来的工艺方法。
凝聚态物理学 结构 bonding 成键 ＞原子与分子物理学＞原子分子的电子结构理论＞释义 bonding 成键 bonding ①成键†，键合 ②焊接 ③连接，结合
计算机硬件 计算机工程制造 释文 bonding 压焊
- monitoring and early warning mechanism
- monitoring and early warning of severe air pollution
- monitoring and early warning system of geological disaster in Cnina
- monitoring and evaluation of vocational education
- monitoring and forecast of agricultural drought
- monitoring and measurement of tunnel and underground engineering
- monitoring and voting plane
- monitoring area
- monitoring camera
- monitoring, control, and surveillance system of fishing vessel
- monitoring control of rock engineering
- monitoring engine
- monitoring environment pollution
- monitoring equipment of fire-fighting equipment power supply system
- monitoring flood and drought hazards
- monitoring for climate change
- monitoring for environmental actions
- monitoring for loads
- monitoring for total amount of pollutants in sewage
- Monitoring method of public opinion
- monitoring of boiler flue gas
- monitoring of broadcast and television
- monitoring of Chinese materia medica resources
- monitoring of coastal geo-environments
- monitoring of collection environment