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thermocompressive bonding
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thermocompressive bonding
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工学
键合技术
释
thermocompressive bonding
热压键合
两金属体(如金-金、铜-铜、铝-铝等相同的金属)在热和压力同时作用下进行原子级接触,通过原子的扩散运动实现键合的技术。又称扩散键合、压力键合。
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