“thermocompressive bonding”的概念、定义、翻译、参考文献-科学参考

单词	thermocompressive bonding
释义	thermocompressive bonding Encyclopedia 工学键合技术释 thermocompressive bonding热压键合两金属体（如金-金、铜-铜、铝-铝等相同的金属）在热和压力同时作用下进行原子级接触，通过原子的扩散运动实现键合的技术。又称扩散键合、压力键合。
随便看	decay chain decay coefficient decay constant decay constants decay cooling decay correlation decay current decay curve decay daughter decayed decay energy decay failure decay fraction decay heat decaying dark matter decaying wave decay instability decay law decay measurement with CSR decay mode decay modes decay of living tree decay of luminescence decay phase decay probability

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。