“thermocompressive bonding”的概念、定义、翻译、参考文献-科学参考

单词	thermocompressive bonding
释义	thermocompressive bonding Encyclopedia 工学键合技术释 thermocompressive bonding热压键合两金属体（如金-金、铜-铜、铝-铝等相同的金属）在热和压力同时作用下进行原子级接触，通过原子的扩散运动实现键合的技术。又称扩散键合、压力键合。
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