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thermocompressive bonding
释义
thermocompressive bonding
Encyclopedia
工学
键合技术
释
thermocompressive bonding
热压键合
两金属体(如金-金、铜-铜、铝-铝等相同的金属)在热和压力同时作用下进行原子级接触,通过原子的扩散运动实现键合的技术。又称扩散键合、压力键合。
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nonautonomous system
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nonautonomous system of differential equations
non-averaging sequence
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non-axisymmetrical distribution
non-axisymmetric disk
non-axisymmetric spinning
non-balanced development
non-baryonic dark matter
non-baryonic matter
nonbasic
nonbasic cell
nonbasic variable
non-basis
non-Bayesian approach
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nonbilayer lipid
non-biodegradable biomedical metal material
nonblocking cache
non-blocking memory access
non bonded interactions
non-bonded interactions
nonbonded interactions
nonbonding electron
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