理学 计算机硬件电路 释 multi-chip package; MCP 多芯片封装 内部包含了多个集成电路的封装形式。
计算机硬件 计算机集成电路 释文 multi-chip package, MCP 多芯片封装
- frictional coefficient
- frictional force
- frictional force microscopy
- frictional lichnoid eruptions
- frictional pressure drop
- frictional pressure drop in two-phase flow
- frictional properties of fiber
- frictional sliding
- frictional soil
- frictional test in plastic forming
- friction and wear properties of ceramics
- friction behavior
- friction braking
- friction coefficient
- friction cone
- friction control
- friction damper
- friction damping
- friction dissipation
- friction drag
- friction drag, fractional drag
- friction drive
- friction effect
- friction factor
- frictionfactor