“flip chip bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	flip chip bonding technology
释义	flip chip bonding technology Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	group set group signature groups in the agriculture negotiations group situational awareness group social work group space group specification group spirit group structure group structure of an elliptic curve group style group symmetry group synchronization group system group table group teaching group technology group technology based layout group test Group Theatre group theorem group-theoretic group-theoretical group-theoretic function group-theoretic interpretation

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