“flip chip bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	flip chip bonding technology
释义	flip chip bonding technology Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	dramatic stage at Yuyuan Garden dramatic stage at Zigong Shaanxi Merchant Guild Hall dramatic stage for a rewarding ceremony dramatic stage for shadow plays and puppet shows in the Guanyin Hall of Gaoyang Town dramatic stage in the Studio of Exhaustion from Diligent Service in the Palace of Tranquil Longevity dramatic stage of Guandi Temple in Hejin City dramatic stage of Qu clan's manor in Luzhou City dramatic stage of the Chaoyang Palace in Fenghuang County dramatic stage of the Clan Fang's Shrine in Wuyuan County dramatic stage of the Dongyue Temple in Dongyang Village, Linfen City dramatic stage of the Dragon God Temple in Lijiang City dramatic stage of the Erlang Temple in Gaoping City dramatic stage of the Foshan Ancestral Temple dramatic stage of the Guanlin Temple in Luoyang City dramatic stage of the Hu Clan Ancestral Hall in Ninghai County dramatic stage of the Luze Guild Hall dramatic stage of the Martial Temple in Gongcheng Yao Autonomous County dramatic stage of the Na Clan Garden dramatic stage of the Ox King Temple in Neiqiu County dramatic stage of the Poh Teck Tung Foundation in Bangkok dramatic stage of the Qiaoze Temple dramatic stage of the Qin's Ancestral Hall in Ningbo City dramatic stage of the Self-cultivation Taoist Temple in Wuzhen dramatic stage of the Shengmu Temple in Shilou County dramatic stage of the Wu Clan Ancestral Hall in Gaochun District

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。