“flip chip bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	flip chip bonding technology
释义	flip chip bonding technology Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	Lord's Day/Sunday Lord Shaftesbury Lord's Prayer Lord Wumu of Chu, Ma Yin Lord Xinling Lord’s Day Alliance of Canada Lorentz Lorentz boost Lorentz boost of Dirac equation Lorentz broadening Lorentz condition Lorentz contracted nuclei Lorentz-contracted nuclei Lorentz contraction Lorentz covariance Lorentz covariant Lorentz crater Lorentz damping Lorentz distribution Lorentz effective fields Lorentz electrodynamics Lorentz factor Lorentz field Lorentz fields Lorentz-FitzGerald contraction

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