“flip chip bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	flip chip bonding technology
释义	flip chip bonding technology Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	factor of type Ⅲ factor of von Neumann algebra factor out factor representation factor ring factor-ring by the radical factor rotation factors factors affecting community structure factors associated with elderly health factor score factor set factor space factors substitutability factor state factor structure factor synthesis law factor system factor theorem factor transformation factory act factory buildings factory-cultivated vegetable seedling factory farming factory law

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。