“flip chip bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	flip chip bonding technology
释义	flip chip bonding technology Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	multiple criteria multiple criteria decision multiple criteria decision making multiple criteria decision making problems multiple cropping multiple cropping in China multiple cropping index multiple cropping in the world multiple cropping rotation multiple dark soliton multiple decision problem multiple degree of freedom vibration isolation multiple development multiple diffraction multiple dimensional soliton multiple disabilities multiple displacement amplification，MDA multiple divisor multiple-domain coupling analysis for MEMS multiple-dosage regimen multiple dosing administration pharmacokinetic analysis multiple drain mesh multiple dwelling unit，MDU multiple edge multiple-effect absorption refrigeration cycle

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