“flip chip bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	flip chip bonding technology
释义	flip chip bonding technology Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	operator automorphism operator bounded below operator calculus operator compact implicit scheme operator-convex operator cosine function operator-difference operator-differential operator-differential equation operator domain operator endomorphism operator equation operator ergodic theorem operator extension problem operator function operator gene operator grammar operator group operator homomorphism operator ideal operator identity operator index operator inequality operator-irreducible representation operator-isomorphic

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