“flip chip bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	flip chip bonding technology
释义	flip chip bonding technology Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	Nanche Shuiku Nanchong Shi Nanchuan dashu tea Nanchuan Jinfoshan Nanchuan Qu Nanci Opera Nanci Opera Inheritance and Development Center in Nanping City Nanci tune opera Nancuiping Park Nancun’s Notes in the Intervals of Ploughing Nancy Nancy Holt Nancy School NAND Nand Nandadevi National Park Nandalal Bose Nandan Kanan Zoological Park Nandan Xian NAND flash NAND gate Nan Ding nanditer high-throughput PCR chip Nan Dongtinghu Shidi Nandu Jiang

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