“flip chip bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	flip chip bonding technology
释义	flip chip bonding technology Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	strict incompatibility strict increasing strict inductive limit strict inequality striction striction band striction curve striction line strict isotonicity strict liability strictly antitone function strictly antitone mapping strictly between strictly categorical set strictly complementary solution strictly concave strictly concave function strictly convex strictly convex Banach space strictly convex [Banach] space strictly convex function strictly convex norm strictly convex set strictly convex space strictly cyclic module

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