“flip chip bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	flip chip bonding technology
释义	flip chip bonding technology Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	loading device loading dock loading dose loading equipment loading factor loading matrix loading mode for irradiation loading rule loading surface loading test loading valve load lifting device load limiter load-line diagram load mathematical model load on bridge engineering load on offshore structure load on port engineering structure load on railway engineering structures Load redistribution model load rejection test for steam turbine load resistance loads for bridge design loadstone load-store architecture

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