“flip chip bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	flip chip bonding technology
释义	flip chip bonding technology Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	ultra-elliptic ultra-elliptic differential equation ultra-elliptic equation ultra-elliptic integral ultrafactorial ultrafast ultrafast capillary electrophoresiss ultrafast differential scanning calorimeter ultrafast electron crystallography ultrafast electron diffraction ultra fast laser ablation ultra-fast laser ablation ultrafast laser ablation ultrafast low energy electron diffraction ultrafast neutron ultrafast nonlinear optics ultrafast optical spectroscopy ultrafast optics ultrafast pinch ultrafast process ultrafast pulse ultrafast pump-probe ultrafast single particle imaging ultrafast single-particle imaging ultrafast spectroscopy

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