“flip chip bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	flip chip bonding technology
释义	flip chip bonding technology Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	simulation of manufacturing processing simulation of structure formation simulation of time-varying scenes simulation of unmanned aerial vehicle flight control system simulation scheduling simulation teaching method simulation technique simulation & training simulation training simulation training for marine navigation simulative simulator simulator room Simula语言 simulcast simultaneity simultaneity concept simultaneity concept of Einstein simultaneity of the three contemplationsin one mind simultaneous simultaneous actuation simultaneous algebraic equations simultaneous altitude simultaneous analysis and optimization design simultaneous approximation

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