“flip chip bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	flip chip bonding technology
释义	flip chip bonding technology Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	control module control moment gyro control network adjustment control network for deformation observation control objectives for information and related technology control of accuracy of an algorithm control of agricultural product control of air cooling system control of automata control of combustion pollution of solid fuel control of complex system control of corruption index control of dissolved oxygen control of fermentation pH level control of fermentation process parameters control of fermentation temperature level control of groundwater quality control of indoor air contaminants control of industrial pollution control of industrial waste water, waste gas, solid waste pollution control of legal institute of metrological verification control of legal metrology control of material structure by ion beam implantation control of medical insects control of network

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。