“flip chip bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	flip chip bonding technology
释义	flip chip bonding technology Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	International Hydrographic Organization International Hydrology Program International Hydropower Association International Ice Hockey Federation international important wetland convention in Rasar in 1971 International Information Bureau on Astronomical Ephemerides International Information Centre for Terminology International Institute for Applied Systems Analysis International Institute for Conservation of Historic and Artistic Works International Institute for Educational Planning International Institute for Information Design International Institute for Strategy Studies International Institute for the Unification of Private Law International Institute of Rural Reconstruction International Instituteof Social History International Institute of Space Law International Institute of Tropical Agriculture，IITA International Institute of Welding international institutions International Intellectual Property Alliance international intellectual property rights protection of intangible cultural heritage International Intermedia Art Festival International Internet Preservation Consortium international investment agreement international investment law

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