“flip chip bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	flip chip bonding technology
释义	flip chip bonding technology Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	activity activity analysis activity assay of alteplase activity assay of recombinant urate oxidase activity-based learning activity-based probe Activity based project cost management activity-based protein profiling activity-based travel demand analysis activity breakthrough activity coefficient activity constant activity curriculum activity decay activity density relative to surface activity determining method by vapor pressure measurement activity diagram activity factor activity index activity life expectancy，ALE Activity Memorial Photographic activity meter activity metrology technology by energy spectrum method activity of the waves activity-on-arrow network diagram

科学参考收录了854744条科技类词条，基本涵盖了常见科技类参考文献及英语词汇的翻译，是科学学习和研究的有利工具。