“flip chip bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	flip chip bonding technology
释义	flip chip bonding technology Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	rule of omitting a conjunction rule of omitting a disjunction rule of omitting an equivalence rule of omitting an implication rule of omitting double negative rule of operation rule of opinion evidence rule of parallelogram rule of permutation Rule of Plant Quarantine Regulations of China（Forestry Part） rule of products rule of propriety rule of public security command rule of rationalization rule of rearrangement of quantifiers rule of reductio ad absurdum rule of regional resources combination rule of risk rule of rounding rule of side fitness rule of signs rule of simplification rule of simultaneous substitution rule of substitution rule of sums

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