“flip chip bonding technology”的概念、定义、翻译、参考文献-科学参考

单词	flip chip bonding technology
释义	flip chip bonding technology Encyclopedia 工学【红外探测器工艺】释 flip chip bonding technology倒装焊工艺通过倒装焊点（即金属凸点阵列）直接将元器件芯片倒扣在读出电路芯片或互连基板上，施加一定的压力使它们焊接在一起，实现元器件和读出电路或基板互连的工艺技术。
随便看	law on the protection of the rights and interests of the special group law on the regulation of international trade Law on University Responsibility and Liberty in 2007 Law on Weights and Measures in the Republic of China Law & Order Law regarding the German National Library Lawrence Lawrence Barrett Lawrence Berkeley National Laboratory Lawrence Durrell Lawrence, Ernest Orlando Lawrence Halprin Lawrence Kohlberg Lawrence Livermore National Laboratory Lawrence of Arabia Lawrence P．Kaufman Lawrence Stone Lawrence Tibbett Lawrence Vambe Lawrencium lawrencium Lawren Stewart Harris Laws about Library of Congress laws amendment during Late Qing Dynasty laws and regulations for concentrator design

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