理学 计算机硬件电路 释 flip chip 倒装焊 一种利用附着在芯片衬垫上的焊接凸点将半导体器件（例如IC芯片、微机电系统）与外部电路相连接的方法。
计算机硬件 计算机集成电路 释文 flip chip 倒装焊
- meltetox
- melt filter
- melt flow index
- melt flow rate
- melt flow ratemeter
- melt flow rate（MFR）of plastic
- melt fraction
- melt fracture
- melt growth
- melt growth method
- melt inclusion
- melt index
- melt index (M)
- melting
- melting analysis
- melting coefficient
- melting curve
- melting, fusion
- melting heat
- melting heat, heat of fusion
- melting index
- melting of superalloy
- melting of vanadium titano-magnetite using blast furnace
- melting-out of grass
- melting point