理学 计算机硬件电路 释 flip chip 倒装焊 一种利用附着在芯片衬垫上的焊接凸点将半导体器件（例如IC芯片、微机电系统）与外部电路相连接的方法。
计算机硬件 计算机集成电路 释文 flip chip 倒装焊
- Medium Method
- medium museum
- medium number
- Medium of artistic communication
- medium or low frequency data
- medium or low frequency trading
- medium power light-emitting diode package
- medium price housing
- medium-range order
- medium-range-order
- medium-range order, intermediate range order
- medium-range order structure
- medium resistance
- medium ring
- medium salt medium
- Medium Scale Anisotropy Measurement Experiment
- medium scale geology map
- medium-scale integrated circuit
- medium shot in film
- medium-sized city
- medium-sized pumped storage power station
- medium slope
- medium speed emulsion
- medium speed mill
- medium speed plate