理学 计算机硬件电路 释 flip chip 倒装焊 一种利用附着在芯片衬垫上的焊接凸点将半导体器件（例如IC芯片、微机电系统）与外部电路相连接的方法。
计算机硬件 计算机集成电路 释文 flip chip 倒装焊
- Project Communication Plan and Control
- project comparison
- project completed and put into production rate
- Project Comprehensive Evaluation Method
- project construction
- project construction stage
- project contract management
- project control
- project coordination
- project corruption
- project cost consulting unit
- Project Cost Management
- project cost management
- project database management
- project decision management
- project decision organization dynamics mechanism
- project delicacy management
- project design
- project design management
- project design of bridge
- Project Earned Value Management Methods
- project economic appraisal
- Project economic evaluation and review
- projected baseline
- projected coordinate system