理学 计算机硬件电路 释 flip chip 倒装焊 一种利用附着在芯片衬垫上的焊接凸点将半导体器件（例如IC芯片、微机电系统）与外部电路相连接的方法。
计算机硬件 计算机集成电路 释文 flip chip 倒装焊
- terrestrial background infrared data
- terrestrial biosphere
- terrestrial branch
- terrestrial communications network
- terrestrial coordinate
- terrestrial coordinate system
- terrestrial digital television
- Terrestrial Dynamical Time
- terrestrial ellipsoid
- Terrestrial Ephemeris Origin
- terrestrial event
- terrestrial exoplanet
- terrestrial eyepiece
- terrestrial globe
- terrestrial gravitation
- terrestrial heat
- terrestrial hydrology
- terrestrial hydrology in China
- Terrestrial Intermediate Origin
- Terrestrial Intermediate Origin，TIO
- Terrestrial Intermediate Reference System
- terrestrial kilometric radiation
- terrestrial latitude
- terrestrial longitude
- terrestrial magnetic disturbance