理学 计算机硬件电路 释 flip chip 倒装焊 一种利用附着在芯片衬垫上的焊接凸点将半导体器件（例如IC芯片、微机电系统）与外部电路相连接的方法。
计算机硬件 计算机集成电路 释文 flip chip 倒装焊
- set of mappings
- set of matrices
- set of measure zero
- set of multiples
- set of multiplicity
- set of natural numbers
- set of non-uniqueness
- set of nowhere dense
- set of numbers
- set of objectives
- set of objects
- set of observations
- set of pairs
- set of points
- set of poles
- set of premises
- set of procedures for manufacturing process
- set of procedures' relations
- set of procedure’s functions
- set of reachable markings
- set of real numbers
- set of representatives
- set of second category
- set of sentences
- set of separability