理学 计算机硬件电路 释 flip chip 倒装焊 一种利用附着在芯片衬垫上的焊接凸点将半导体器件（例如IC芯片、微机电系统）与外部电路相连接的方法。
计算机硬件 计算机集成电路 释文 flip chip 倒装焊
- He Shenɡrui
- He Shikai
- Heshilie Zhining
- Heshilie Zhizhong
- He Shiyao
- He Shouan
- Heshui Xian
- Heshun Xian
- He Shunxin
- He Sijing
- Hesiodos
- hesitant fuzzy aggregation algorithms
- hesitant fuzzy evaluation method
- hesitant fuzzy measure theory
- hesitant fuzzy preference theory
- hesitant pulse
- Hesitate
- hesitation clause
- hesitation wound
- hesperetin
- Hesperia
- hesperidinase
- hesperidium
- Hesperus
- HESS