理学 计算机硬件电路 释 flip chip 倒装焊 一种利用附着在芯片衬垫上的焊接凸点将半导体器件（例如IC芯片、微机电系统）与外部电路相连接的方法。
计算机硬件 计算机集成电路 释文 flip chip 倒装焊
- chronic cheilitis
- chronic cholecystitis
- chronic combat stress response
- chronic constrictive pericarditis
- chronic cough
- chronic damage of locomotion system
- chronic diarrhea
- chronic eosinophilic leukemia
- chronic epididymitis
- chronic exposure
- chronic fatigue syndrome
- chronic gastritis
- chronic glomerulonephritis
- chronic granulomatous disease
- chronic granulomatous inflammation
- chronic hematogenous osteomyelitis
- chronic hyperplastic laryngitis
- chronic hypertrophic phryngitis
- chronic infantile convulsion
- chronic infantile malnutrition
- chronic injury
- chronic injury of soft tissue
- chronic interstitial nephritis
- chronic intestinal pseudo-obstruction
- chronic kidney disease-mineral and bone abnormalities