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electronic packaging failure
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electronic packaging failure
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electronic packaging failure
电子封装失效
机械、热、化学或电作用导致电子封装产品性能不合要求,如产品的性能参数和特征超过了可接受范围的情况。
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high-temperature adhesive
high temperature and conductivity high copper alloy
high temperature and high pressure method
high temperature and humidity aging test
high temperature battery
high temperature carbonization
high temperature carbonization gas
high temperature coal tar
high temperature coatings
high temperature cocking
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high temperature convective geothermal system
high temperature cooling and low temperature heating system
high temperature corrosion in pulverized coal boiler
high temperature corrosion of gas turbine
high temperature corrosion on the fire side
high temperature corrosion-resistant coating
high temperature creep
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